01
Samsung and Broadcom sign AI chip partnership spanning memory, foundry and advanced packaging
AI ChipsFoundryAdvanced Packaging
On July 25, Samsung Electronics announced a long-term partnership with Broadcom covering memory chips, contract manufacturing and advanced packaging, with cooperation expected to exceed USD 200 billion through 2030.
The agreement gives Samsung a major opportunity to improve utilization across its advanced manufacturing operations while strengthening Broadcom’s access to AI-related semiconductor capacity.
R&A View: Large AI customers are increasingly securing several parts of the supply chain through one strategic agreement. Relevant watchpoints include HBM, advanced-node wafers, substrates, packaging materials, test capacity and high-speed interconnect components.
02
CXMT raises USD 8.6 billion and surges in its Shanghai market debut
DRAMChina LocalizationCapacity Expansion
Chinese memory-chip maker CXMT raised about USD 8.6 billion in the largest Asian IPO of 2026 and began trading in Shanghai on July 27. Its shares closed 466% above the offer price on the first day.
The fundraising gives CXMT additional capital for technology development and capacity expansion, while the sharp debut reflects strong investor interest in memory and semiconductor localization.
R&A View: A successful IPO strengthens CXMT’s financial position, but buyers should separate market valuation from qualified supply. Product maturity, yield, customer certification, export controls and suitability for different end markets remain essential checks.
03
China reportedly begins producing domestically developed immersion DUV lithography tools
DUV LithographySemiconductor EquipmentChina
On July 27, China was reported to have started manufacturing domestically developed immersion deep-ultraviolet lithography machines. Initial tools are expected to be delivered this year to SMIC, Hua Hong Semiconductor and CXMT.
The development could support China’s effort to reduce dependence on imported chipmaking equipment, although production performance and customer qualification remain important uncertainties.
R&A View: Near-term attention should remain on overlay accuracy, throughput, uptime, component localization and the time required for fabs to complete equipment validation. Initial production does not automatically mean high-volume manufacturing readiness.
04
AMD secures access to up to 2.5GW of AI-ready data-center capacity
AI InfrastructureData CenterPower Capacity
On July 28, AMD signed an agreement with Core Scientific for access to more than 500MW of AI-ready data-center capacity from 2027, with expansion potential of up to 2.5GW.
The companies will also work together on physical infrastructure design and the deployment of AMD chips and software.
R&A View: AI chip competition is increasingly linked to electricity, land, cooling and data-center availability. Chip suppliers may need to secure infrastructure directly rather than relying only on cloud customers and server manufacturers.
05
U.S. awards GlobalFoundries USD 300 million for silicon photonics and co-packaged optics
Silicon PhotonicsCo-Packaged OpticsAI Interconnect
On July 29, the U.S. government announced a USD 300 million award to GlobalFoundries for research and development in silicon photonics for more efficient AI data centers.
The funding also supports co-packaged optics, which places optical connectivity closer to AI processors to improve bandwidth and energy efficiency.
R&A View: As electrical interconnects face power and bandwidth limits, silicon photonics and co-packaged optics are becoming more strategic. Optical engines, lasers, photonic ICs, fiber components, precision alignment and thermal management remain key watchpoints.
06
Qualcomm plans September price increases as it expands beyond smartphones
PricingMobile ChipsData Center
On July 29, Qualcomm issued weaker-than-expected quarterly profit guidance and said Apple-related revenue is expected to decline more quickly. The company plans to raise prices from September 1 to address higher supply-chain costs.
Qualcomm is also accelerating its push into data-center and AI products as it seeks to reduce dependence on smartphones.
R&A View: Customers using Qualcomm platforms should review quote validity, product-specific price changes and approved alternatives before the adjustment takes effect. The company’s diversification may also shift future demand toward high-bandwidth compute and data-center components.
07
Arm forecasts continued growth as AI data-center demand offsets smartphone uncertainty
Arm ArchitectureAI CPUsData Center
On July 29, Arm forecast quarterly revenue above market expectations, supported by stronger licensing and royalty demand for more advanced chips.
Data-center demand remains strong as cloud companies and semiconductor suppliers adopt Arm-based CPUs for AI inference and other power-sensitive workloads, although smartphone royalty growth may weaken.
R&A View: AI infrastructure demand is broadening beyond accelerators into CPUs and system-control processors. This may support server motherboards, memory, PMICs, network interfaces, retimers and high-speed connectivity around Arm-based platforms.
08
Samsung expects semiconductor supply shortages to continue into 2028
Memory SupplyLong-Term ContractsAllocation Risk
On July 30, Samsung said semiconductor shortages may worsen and continue into 2028. The company has signed supply agreements lasting at least five years with major global data-center operators.
Some contracts include upfront payments and minimum-price protections, and long-term agreements could cover a substantial share of Samsung’s future memory output.
R&A View: Long-term capacity commitments reduce the amount of supply available to the open market. Programs involving HBM, server DRAM, NAND and related products should review multi-year forecasts, allocation arrangements and approved substitutes earlier.
